- Application: Insulation Board for Semiconductor Resin Encapsulation Mold
- Material: Insulating and Heat-Resistant Material MIOLEX PGX-595
- Processing Method: Cutting by Machining Center
The Insulating and Heat-Resistant Material MIOLEX PGX-595 is a rigid insulation board composed of stacked glass fiber sheets bonded together with inorganic binders. It boasts high strength and can be used as a structural material. It does not contain asbestos. The product shown in the photograph has been machined using a machining center from MIOLEX PGX-595 and is utilized as an insulation board for semiconductor resin encapsulation molds. For more details about MIOLEX PGX-595, please refer below.
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