Insulation Material for Semiconductor Resin Encapsulation Mold Side – Insulating and Heat-Resistant Material KALHON Machining
Application: Insulation Material for Semiconductor Resin Encapsulation Mold Side Material: Insulating and Heat-Resistant Material KALHON Processing Method: Cutting by Machining Center The Insulating and Heat-Resistant Material KALHON, containing air layers,
Leave a comment