- Application: Insulation Material for Semiconductor Resin Encapsulation
- Mold Side Material: Insulating and Heat-Resistant Material KALHON
- Processing Method: Cutting by Machining Center
The Insulating and Heat-Resistant Material KALHON, containing air layers, excels in insulation effectiveness compared to rigid insulation boards.
However, its strength is weaker compared to rigid insulation materials, making it unsuitable for areas subject to pressure. Therefore, it is recommended for use in areas where strength is not a primary concern, as it provides better insulation effectiveness than rigid insulation boards.
The product shown in the photograph has been machined using a machining center from KALHON and is utilized as insulation material for the side of semiconductor resin encapsulation molds.
Translation by GPT.