Thick Film Substrates & Packages (Plating) – MARUWA Corporation
Thick film metallized substrates have been developed by combining proven ceramic materials and thick film metallization technology.
Various patterning technologies allow us to support custom-made requirements. Main applications are semiconductor lasers, medical lasers and other similar products.
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Applications
Submount substrate for industrial equipment and medical equipment
Specification
Item | Standard Specification | ||
---|---|---|---|
Substrate Material | Material | Aluminum Nitride (AlN) | Themal conductivity 170W,200W,230W |
Thickness | 0.25~1.00mmt | – | |
Work Size | 50.8□(2inch□),2inch×4inch□ | ||
Film Specification | Film Composition | electrolytic plating NiAu specification:Cu / Ni / Au=20~80μm / >1μm / >0.5μm(MW recommendation) | |
Film Thickness | Cu thickness:30~80±15μm(standard),±10μm(special) | ||
Solder | AuSn composition:(eg)Au / Sn=75 / 25±5wt%(ratio is flexible) | ||
AuSn thickness: 1.5μm~7μm±20% | |||
Pattern | Accuracy L / S=100μm / 150μm(Cu thickness over 50μm),50μm / 80μm(Cu thickness 30μm target) | ||
others | Cutting process | ±50μm( speical ±20μm) |
electrolytic plating NiAu specification (MW recommendation) |
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Standard specification for Thick Film Metallization (Plating) |
In the case of electrolytic specification, an electrode wire is required for each land |
Thickened Au is possible. (Standard thickness about 1.5 μm |
Item | Inspection Item | Measurement Inspection Machines |
---|---|---|
Quality Assurance | Size | Measuring Microscope |
Film Thickness | X-ray Fluorscence, Surface Rough Meter | |
Resistance | Digital Multi Meter | |
Externals | Microscope | |
Wire Strength | Pltester |
Pattern accuracy
Dimension position | Minimum Size |
---|---|
A Conducter Size | 0.100mm |
B Pattern Interval | 0.150mm |
C Substance Thickness – Pattern Interval | 0.050mm |
D Pattern – Hole Interval | 0.100mm |
Manufacturing and sales of ceramic products and lighting equipment.
MARUWA Corporation The Ceramics business includes ceramic and electronic components and devices and quartz glass. The company manufactures and sells ceramic substrates used as components of electronic circuits, EMC components for noise reduction, and quartz glass components for the semiconductor field. Together with MARUWA SHOMEI Co., Ltd. and YAMAGIWA Co., Ltd. the company also manufactures and sells lighting equipment, such as LED road lighting and interior lighting equipment. The company has a subsidiary in Malaysia that manufactures and sells ceramic products, and subsidiaries in Taiwan, the U.K., Korea, China, the U.S., and India that sell ceramic products.
Supplier Information
- Store Name: MARUWA CO., LTD.
- Vendor: MARUWA CO., LTD.
- Address: 488-0044
Aichi Owari-Asahi 3-83, Minami Honjigahara-cho
- Electrical Ceramics, Electronic Accessories & Supplies, Electronic Components
Thick Film Substrates & Packages (Screen Printing) – MARUWA Corporation
Electrical Ceramics, Electronic Accessories & Supplies, Electronic ComponentsThick Film Substrates & Packages (Screen Printing) – MARUWA Corporation
Thick film printed and high temperature sintered substrates using excellent thermal conductivity materials, Alumina and Aluminum Nitride (AlN).
Electrode formed ceramic substrates can be miniatuarized and multifunctional.
VIA structure can connect between top and bottom surfaces.SKU: n/a - Electrical Ceramics, Electronic Accessories & Supplies, Electronic Components
AlN Multilayered Ceramic Substrates & Packages – MARUWA Corporation
Electrical Ceramics, Electronic Accessories & Supplies, Electronic ComponentsAlN Multilayered Ceramic Substrates & Packages – MARUWA Corporation
Due to its multilayered structure, circuit designs can be delivered flexibly through layers and complex structures, e.g. cavity structures, are available.
AlN, an excellent heat disspation material, has been proven to efficiently release the heat from high heat generating IC chips.
SKU: n/a - Electrical Ceramics, Electronic Accessories & Supplies, Electronic Components
Alumina Multilayered Ceramic Substrates & Packages (HTCC) – MARUWA Corporation
Electrical Ceramics, Electronic Accessories & Supplies, Electronic ComponentsAlumina Multilayered Ceramic Substrates & Packages (HTCC) – MARUWA Corporation
Due to its multilayered structure, circuit designs can be delivered flexibly through layers and complex structures.
e.g. cavity structures, are available.
SKU: n/a