Semiconductor
Showing 1–24 of 78 results
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Cleaning & Disinfection equipment, Food & Beverage Machinery
AION BE-Fine – AION Co.Ltd.
AION’s PVA sponge from a novel manufacturing technique—realizing, along with an improved degree of cleanliness, advanced strength and a soft texture.
A PVA sponge in which cleanliness is improved by a novel manufacturing technique free of pore-generating agents.
The scrubbing medium is sponge material excelling in physical strength including the tensile strength and rupture strength required as a wipe-up medium.
Our Be-Fine sponges realize high-level porosity compared with conventional PVA sponges while making a soft texture possible.
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Food & Beverage Machinery, Other Food & Beverage Machinery
AION PVA Sponge Sheet D-Series and W-Series – AION Co.Ltd.
Food & Beverage Machinery, Other Food & Beverage MachineryAION PVA Sponge Sheet D-Series and W-Series – AION Co.Ltd.
AION’s PVA sponges in sheet and block media: Firm when dry, softening when holding moisture, readily processed into shapes of all kinds.
Offered in numerous product models, our PVA sponges may be employed in a variety of areas, including moisture wicking, scrubbing, and wipe-up.
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Electrical Ceramics, Electronic Accessories & Supplies, Electronic Components
AlN Multilayered Ceramic Substrates & Packages – MARUWA Corporation
Electrical Ceramics, Electronic Accessories & Supplies, Electronic ComponentsAlN Multilayered Ceramic Substrates & Packages – MARUWA Corporation
Due to its multilayered structure, circuit designs can be delivered flexibly through layers and complex structures, e.g. cavity structures, are available.
AlN, an excellent heat disspation material, has been proven to efficiently release the heat from high heat generating IC chips.
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Cleaning Equipment, Industrial Machinery, Other Cleaning Equipment
Automatic cleaning equipment (cleaning booths and air knife booths) – shimizu industry
Cleaning Equipment, Industrial Machinery, Other Cleaning EquipmentAutomatic cleaning equipment (cleaning booths and air knife booths) – shimizu industry
Although most of the cleaning equipment nowadays is G8 size for smartphones and tablets, we have also received requests for G10 size large panel cleaning equipment and have delivered it to customers.
The main body size is 3000 x 2000 x 1200Hmm LCD panel cleaning equipment.
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Lab Supplies, Other Lab Supplies, Testing Instrument & Equipment
Automatic Ellipsometer MARY-102 – Five Lab Co. Ltd.
Lab Supplies, Other Lab Supplies, Testing Instrument & EquipmentAutomatic Ellipsometer MARY-102 – Five Lab Co. Ltd.
Compact size, lower price, higher accuracy and user friendly software.
Ellipsometer is optical instruments which measure the change in polarization state of light beam upon reflection from a sample surface to analyze the film thickness, the optical constants as the refractive index / absorption, or the optical constants of bulk materials.
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Electronic Components, Other Electronic Components
Cleaning Material for Wafer Chuck TableCleaning Wafer™ – Nitto Denko Corporation
Electronic Components, Other Electronic ComponentsCleaning Material for Wafer Chuck TableCleaning Wafer™ – Nitto Denko Corporation
The Cleaning Wafer is for removing small particles on the robot arms or chuck tables of semiconductor-manufacturing equipment.
The Cleaning Wafer, having a special cleaning layer, can remove small particles in the semiconductor manufacturing equipment. Down-time of tools can be drastically reduced by using the cleaning wafer, compared with the ordinal hand cleaning method. The cleaning wafer can also be used for preventive maintenance so that yield improvement can be expected.
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Industrial Laser Equipment, Industrial Machinery, Laser Equipment Parts
CuW submounts – TECNISCO LTD.
Industrial Laser Equipment, Industrial Machinery, Laser Equipment PartsCuW submounts – TECNISCO LTD.
This CuW submount is used as a heat sink for high power LD modules.
Alignment with LD, and sharp edge and control of warpage for effective thermal conductivity are available.
Redundant solder can be controlled in AuSn vapor deposition on the LD bonding area.SKU: n/a -
Electronic Components, Other Electronic Components
Die Attach Film with Pressure Sensitive Dicing TapeELEP MOUNT™ (EM Series) – Nitto Denko Corporation
Electronic Components, Other Electronic ComponentsDie Attach Film with Pressure Sensitive Dicing TapeELEP MOUNT™ (EM Series) – Nitto Denko Corporation
Achieves high reliability by combining dicing and die attachment functions.
This adhesive film is for fixing IC chips to a lead frame or interposer in the semiconductor assembly process. It is useful in realizing high adhesive reliability and in BOC and stacked CSP manufacturing processes, solving conventional silver paste bleeding problems which cause short circuits. It has also been designed to enable use in a continuous process in combination with fixing tape for dicing.
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Industrial Machinery, Machinery Engines & Parts, Mechanical Accessories
Diesel Generator Set – Tominaga Co.Ltd.
Industrial Machinery, Machinery Engines & Parts, Mechanical AccessoriesDiesel Generator Set – Tominaga Co.Ltd.
KOHLER, the world’s leading brand in diesel generators, is another of our major strengths.
We offer a wide variety of packages from open type to full enclosure type and container type for all applications from 20kVA to 4000kVA. Control panels are also available in a wide range of variations, from simple control panels to screen monitor types.
Please consult with us about parallel operation and commercial grid connection. We provide after-sales service for engines from John Deere, Volvo, MTU, and others, all of which we are responsible for.SKU: n/a -
Electronic Components, Other Electronic Components
Heat Resistance Back Grinding Tape – Nitto Denko Corporation
Electronic Components, Other Electronic ComponentsHeat Resistance Back Grinding Tape – Nitto Denko Corporation
Back-grinding tape with heat resistance is for special heating process after wafer grinding.
Heat resistance back grinding tape can correspond to the secondary process of wafer backside. After the back-grinding process, the wafers with the heat resistance back grinding tape can be processed (wet etching, ashing, metalizing, exposure/processing and so on).
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Optical Instruments, Spectrometers, Test Instruments, Testing Instrument & Equipment
High Performance Tunable Laser λ-Master – Spectra Quest Lab. Inc.
Optical Instruments, Spectrometers, Test Instruments, Testing Instrument & EquipmentHigh Performance Tunable Laser λ-Master – Spectra Quest Lab. Inc.
“1mm Band ASE-Free Tunable Diode Laser”
Our wavelength tunable lasers use our proprietary transposed Littman-type external resonator structure to completely separate the ASE from the output optical axis without sacrificing optical output intensity, achieving both high output intensity and high spectral purity (ASE-free). In addition, the Littman configuration, which is a geometrically and mathematically ideal configuration, is partially deformed to compensate for the dispersion of the LD chip and optics to achieve mode hop-free tuning over a wide wavelength bandwidth even in the 1um band, where chip dispersion becomes apparent, let alone in the communication band. To fully use the performance of the external cavity, a stepper motor type pressure contact slider with backlash-free and ultra-precise motion is used as the wavelength tuning actuator to achieve wavelength sweep performance that contributes to precision spectroscopic measurement. Other features include an analog wavelength sweep function using PZT, an auto-focus function for fiber couplings that takes advantage of high output power, and a data acquisition function synchronized to wavelength tuning, all of which can be fully utilized by the spectroscopic measurement software to meet the high demands of laboratory users. The software is available in executable file format, and LabVIEW source code is also distributed.
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Air Cooled Chiller, Cooling Refrigeration Equipment, Food & Beverage Machinery, Water Chillers
High Precision Water Temperature Controller Precision Chiller PEC – ORION Machinery Co. LTD.
Air Cooled Chiller, Cooling Refrigeration Equipment, Food & Beverage Machinery, Water ChillersHigh Precision Water Temperature Controller Precision Chiller PEC – ORION Machinery Co. LTD.
ORION’s original refrigeration circuit showcases our complete pursuit of ultra energy savings and high precision temperature control.
Cooling Capacity
1.0 to 6.2kW
Operable Ambient Temperature Range
10 to 40℃(PEC400B1-VW)
15 to 35℃(PEC900B1-VW、PEC15000A1-V)
Operable Liquid Temperature Range
10 to 60℃
※ These values indicate the maximum range for the series. Actual values will differ depending on the model.
Temp Control Precision
±0.05℃Heat Pump Balance Control
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Cleaning Equipment, High-pressure Cleaner, Industrial Machinery
Highly Concentrated Ozone Water Cleaning System AURORA – HUG Power Co. Ltd.
Cleaning Equipment, High-pressure Cleaner, Industrial MachineryHighly Concentrated Ozone Water Cleaning System AURORA – HUG Power Co. Ltd.
resist stripping system
AURORA is a resist stripping system that can strip resist after ion implantation at low temperatures. By combining plasma treatment (removal of hardened layer) and ozonated water treatment (resist removal), it can remove resist without leaving any residue, and can also remove resist without damaging the underlying film (such as Si, SiO2, etc.). Furthermore, running costs and the number of processes are reduced by eliminating chemicals such as sulfuric acid permeate and ammonia permeate. High throughput can be achieved due to its fast removal rate (2 to 4 μm/min).
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Chemical Goods, Inorganic Chemicals
HIPRESICA – UBE EXSYMO CO. LTD.
HIPRESICA is monodisperse silica (silicon dioxide) particles produced from high purity silicon alkoxide and synthesized by a sol-gel method.
Its truly spherical particles and highly uniform particle size with little inclusion of coarse particles provide extremely sharp particle size distribution. As extremely highly pure particles, HIPRESICA has virtually no impurities. Usages for precision gap spacers in liquid crystal displays (LCD), and other displays, along with gap spacers in electric and electronic devices. Highly pure fillers for semiconductor sealing material and highly functional adhesive are also part of its application.
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Converter, Electronic Components
ICE11N70FP – IceMOS Technology Ltd.
Superjunction MOSFETs are important energy-saving devices that can be applied to most power supply applications.
Our super junction MOSFETs are manufactured by our patented MEMS trench process through our foundry partner in Japan for wafer fabrication, and are shipped after assembly and inspection in Asia. Our technical team with over 20 years of semiconductor manufacturing experience is available to support our customers. Management systems are also managed by our company and supply chain with IATF16949, ISO9001, and ISO14001 certifications.
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Converter, Electronic Components
ICE20N60 – IceMOS Technology Ltd.
Superjunction MOSFETs are important energy-saving devices that can be applied to most power supply applications.
Our super junction MOSFETs are manufactured by our patented MEMS trench process through our foundry partner in Japan for wafer fabrication, and are shipped after assembly and inspection in Asia. Our technical team with over 20 years of semiconductor manufacturing experience is available to support our customers. Management systems are also managed by our company and supply chain with IATF16949, ISO9001, and ISO14001 certifications.
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Converter, Electronic Components
ICE47N60W – IceMOS Technology Ltd.
Superjunction MOSFETs are important energy-saving devices that can be applied to most power supply applications.
Our super junction MOSFETs are manufactured by our patented MEMS trench process through our foundry partner in Japan for wafer fabrication, and are shipped after assembly and inspection in Asia. Our technical team with over 20 years of semiconductor manufacturing experience is available to support our customers. Management systems are also managed by our company and supply chain with IATF16949, ISO9001, and ISO14001 certifications.
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Converter, Electronic Components
ICE8S65FP – IceMOS Technology Ltd.
Superjunction MOSFETs are important energy-saving devices that can be applied to most power supply applications.
Our super junction MOSFETs are manufactured by our patented MEMS trench process through our foundry partner in Japan for wafer fabrication, and are shipped after assembly and inspection in Asia. Our technical team with over 20 years of semiconductor manufacturing experience is available to support our customers. Management systems are also managed by our company and supply chain with IATF16949, ISO9001, and ISO14001 certifications.
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Industrial Laser Equipment, Industrial Machinery, Laser Equipment Parts
Insulation type Cu-AlN-Cu submounts – TECNISCO LTD.
Industrial Laser Equipment, Industrial Machinery, Laser Equipment PartsInsulation type Cu-AlN-Cu submounts – TECNISCO LTD.
This is a heat sink for high-power LD (Laser diode) modules.
Three-layer composition achieves both high thermal conductivity and insulation quality. Control of Cu plating thickness makes the heat sink match with the LD, resulting in higher power and longer life of the LD module. Because pullback is not required on the critical edge area, it has a high degree of freedom in designing. Moreover, it can be applied to a variety of application by this freedom in design.
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