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ICE10N60 – IceMOS Technology Ltd.


Superjunction MOSFETs are important energy-saving devices that can be applied to most power supply applications.

Our super junction MOSFETs are manufactured by our patented MEMS trench process through our foundry partner in Japan for wafer fabrication, and are shipped after assembly and inspection in Asia. Our technical team with over 20 years of semiconductor manufacturing experience is available to support our customers. Management systems are also managed by our company and supply chain with IATF16949, ISO9001, and ISO14001 certifications.

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Features

  • Low rDS(on)
  • Ultra Low Gate Charge
  • High dv/dt capability
  • High Unclamped Inductive Switching (UIS) capability
  • High peak current capability
  • Increased transconductance performance
  • Optimized design for high performance power systems

Product Summary

ID TA=25℃ 10A Max
V(BR)DSS ID=250uA 600V Min
rDS(on) VGS=10V 0.27 Typ
Qg VDS=480V 43nC Typ

We are a manufacturer of power MOSFET and MEMS technology base wafers

“IceMOS Technology was founded in 2004 as a US headquartered company with manufacturing operations in Northern Ireland (the UK). Our office locations also include Design, R&D, and Engineering staff in Tokyo and Tempe Arizona. The IceMOS offering is created around three areas of product, High-Voltage (600V-730V) Superjunction Power MOSFETs, MEMS Sensing Elements, and Advanced Engineered Substrate (bonded silicon and silicon-on-insulator (SOI) substrates). These products are used in a variety of applications across a number of industries.
Our Superjunction MOSFET devices are original IceMOS designs enabled by our own Intellectual Property. A Hybrid-Manufacturing Model, combining external manufacturing partnership and internal processing capabilities, is used to bring this best-in-class device to our customers. ”

Established in 2004, IceMOS Technology is focused on establishing itself as a best-in-class provider of cost effective/high performance Super Junction MOSFETs, MEMS solutions and Advanced Engineering Substrates.

IceMOS has developed an innovative deep trench MEMS Super Junction High Voltage MOSFET that outperforms competing solutions with a much simpler, lower cost process. Super Junction MOSFET applications include:

LED TV drivers and power supplies
Lighting HID and LED ballast
Electric and hybrid cars
Solar inverters
IT hardware: servers, laptops, and tablets
The Company is well-positioned to benefit from many of the trends in clean technology and cloud computing.

IceMOS is a global leader in the development and manufacture of high quality MEMS product substrates as well as advanced engineering substrates based on our wafer bonding technology. Our products include:

Thick Film Silicon on Insulator (SOI)
Silicon – Silicon Direct Bonded Wafers (SiSi)
Double / Multi layer SOI and SiSi
Trench isolation SOI
Cavity SOI
Through Silicon Via Interconnect
Custom Advanced Engineering Substrates

Our core expertise is in Wafer Bonding, Deep Reactive Ion Etch (DRIE) and wafer shaping.

We utilise our expertise in DRIE to offer trench etch and refill services to customers on bulk Si substrates or on SOI. Combining both our SOI and trench etch and refill technology, we offer customers a unique dielectrically isolated substrate preparation service.

SOI material is used widely in applications such as telecommunications products and optical devices, dielectrically isolated integrated circuits, solid state relays and micro machined components for MEMS sensors, actuators and Silicon watch parts for the Swiss luxury watch industry.

IceMOS will work directly with the customer to develop a unique specialized product if this is not already on offer. It is with this, that IceMOS’s product portfolio remains unrivaled.

Encompassing over ten years of expertise, unsurpassed manufacturing skill and the latest developments in technology, IceMOS ensures that each customer receives outstanding service from the point of initial enquiry through to product delivery. Along with offering innovative product development, design and specialized services, the engineering team at IceMOS provides an array of technical support.

The dedicated team offer customers the opportunity to receive tailored solutions and unique services by delivering the latest innovations in the Semiconductor industry.

Awarded the ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016 IceMOS is prided on continual investment in quality procedures. Providing ongoing employee training, IceMOS ensure that each employee is kept up-to-date on the latest technology advancements in high-tech manufacturing.

Need more info ?

ICE10N60 N-Channel Enhancement Mode MOSFET Data Sheet

IceMOS Technology Ltd.

View Catalog

Supplier Information

  • Store Name: IceMOS Technology Ltd.
  • Vendor: IceMOS Technology Ltd.
  • Address: 5 Hannahstown Hill
    Belfast
    Northern Ireland
    BT17 0LT
    United Kingdom (UK)

Features

  • Low rDS(on)
  • Ultra Low Gate Charge
  • High dv/dt capability
  • High Unclamped Inductive Switching (UIS) capability
  • High peak current capability
  • Increased transconductance performance
  • Optimized design for high performance power systems

Product Summary

ID TA=25℃ 10A Max
V(BR)DSS ID=250uA 600V Min
rDS(on) VGS=10V 0.27 Typ
Qg VDS=480V 43nC Typ

We are a manufacturer of power MOSFET and MEMS technology base wafers

“IceMOS Technology was founded in 2004 as a US headquartered company with manufacturing operations in Northern Ireland (the UK). Our office locations also include Design, R&D, and Engineering staff in Tokyo and Tempe Arizona. The IceMOS offering is created around three areas of product, High-Voltage (600V-730V) Superjunction Power MOSFETs, MEMS Sensing Elements, and Advanced Engineered Substrate (bonded silicon and silicon-on-insulator (SOI) substrates). These products are used in a variety of applications across a number of industries.
Our Superjunction MOSFET devices are original IceMOS designs enabled by our own Intellectual Property. A Hybrid-Manufacturing Model, combining external manufacturing partnership and internal processing capabilities, is used to bring this best-in-class device to our customers. ”

Established in 2004, IceMOS Technology is focused on establishing itself as a best-in-class provider of cost effective/high performance Super Junction MOSFETs, MEMS solutions and Advanced Engineering Substrates.

IceMOS has developed an innovative deep trench MEMS Super Junction High Voltage MOSFET that outperforms competing solutions with a much simpler, lower cost process. Super Junction MOSFET applications include:

LED TV drivers and power supplies
Lighting HID and LED ballast
Electric and hybrid cars
Solar inverters
IT hardware: servers, laptops, and tablets
The Company is well-positioned to benefit from many of the trends in clean technology and cloud computing.

IceMOS is a global leader in the development and manufacture of high quality MEMS product substrates as well as advanced engineering substrates based on our wafer bonding technology. Our products include:

Thick Film Silicon on Insulator (SOI)
Silicon – Silicon Direct Bonded Wafers (SiSi)
Double / Multi layer SOI and SiSi
Trench isolation SOI
Cavity SOI
Through Silicon Via Interconnect
Custom Advanced Engineering Substrates

Our core expertise is in Wafer Bonding, Deep Reactive Ion Etch (DRIE) and wafer shaping.

We utilise our expertise in DRIE to offer trench etch and refill services to customers on bulk Si substrates or on SOI. Combining both our SOI and trench etch and refill technology, we offer customers a unique dielectrically isolated substrate preparation service.

SOI material is used widely in applications such as telecommunications products and optical devices, dielectrically isolated integrated circuits, solid state relays and micro machined components for MEMS sensors, actuators and Silicon watch parts for the Swiss luxury watch industry.

IceMOS will work directly with the customer to develop a unique specialized product if this is not already on offer. It is with this, that IceMOS’s product portfolio remains unrivaled.

Encompassing over ten years of expertise, unsurpassed manufacturing skill and the latest developments in technology, IceMOS ensures that each customer receives outstanding service from the point of initial enquiry through to product delivery. Along with offering innovative product development, design and specialized services, the engineering team at IceMOS provides an array of technical support.

The dedicated team offer customers the opportunity to receive tailored solutions and unique services by delivering the latest innovations in the Semiconductor industry.

Awarded the ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016 IceMOS is prided on continual investment in quality procedures. Providing ongoing employee training, IceMOS ensure that each employee is kept up-to-date on the latest technology advancements in high-tech manufacturing.

Need more info ?

ICE10N60 N-Channel Enhancement Mode MOSFET Data Sheet

IceMOS Technology Ltd.

View Catalog

Supplier Information

  • Store Name: IceMOS Technology Ltd.
  • Vendor: IceMOS Technology Ltd.
  • Address: 5 Hannahstown Hill
    Belfast
    Northern Ireland
    BT17 0LT
    United Kingdom (UK)