Stealth dicing equipment – Seishin Trading Co. Ltd.
High-speed, high-precision processing of difficult samples
High-speed, high-precision processing of difficult samples
This system is equipped with a stealth dicing engine (Hamamatsu Photonics’ patented technology), which makes it possible to cut transparent materials, which until now have been considered difficult to process with precision and high accuracy.
Features
Workpieces that can be processed
- Glass
- Sapphire
- SiC
- GaN
- LiTaO3, LiNbO3
- Quartz
What is stealth dicing?
Stealth dicing is a method of forming a modified layer inside a workpiece by focusing a laser beam inside the workpiece, and then using a tape expander or other means to separate the chips. Please see the video for an image.
General Equipment Specifications
| Mechanism | General outline specifications |
|---|---|
| Laser Division | Oscillator Short pulse laser oscillator *Laser can be selected according to the object to be processed. Optics: Hamamatsu Photonics 3G-SDE |
| Dimensions and weight (excluding maintenance space) |
Equipment main unit approx. 1905mm (W) x 1802mm (D) x 1805mm (H) x weight approx. 2700kg Power supply and chiller rack Approx. 553mm (W) x 400mm (D) x 240mm (H) |
| Applicable substrate size | Substrate size Max160mm×160mm Substrate thickness 0.1mm~0.5mm |
| Stage Specifications | XY axis Travel range 500mm(X)×500mm(Y) Travel speed 1000mm/sec(Max) Feed mechanism Linear motor Absolute position accuracy X-axis: 8μm Y-axis: 7μm Repeat positioning accuracy ±1μm Resolution ±0.5μm Z-axis Travel range Max8mm Travel speed 1mm/sec Absolute positioning accuracy ±0.5μm O-axis Rotation range 360° Max. Rotation speed Max90°/sec Absolute positioning accuracy ±1μm Vacuum pick-up table Substrate fixation Vacuum suction |
| Substrate transfer robot | Method Cylindrical Coordinate Robot Board clamping method Mechanical check Workpiece detection Workpiece detection function in cassette Cassette for 8-inch |
| Other | Camera alignment Corrects for tilt and misalignment of XY coordinates Output measurement Equipped with power meter |
| Supply voltage | Power supply AC200V±20V single phase 50/60kHz Air pressure 0.5Mpa or more |
Video
GO WEST！GO BSET!
Proposals beyond the standard, to the world.
What kind of company is SEISHIN?
Are you a manufacturer? A trading company? Both, of course. SEISHIN.
Since our establishment on March 10, 1952, we have introduced a wide variety of products to Japan to protect the quality of Japanese industrial products, including imports of analytical standard materials, consumables related to thick film ICs, and equipment, with our greatest strength being our ability to respond quickly to customer needs. Today, we are not only a trading company, but also a manufacturer of mass-production equipment for electronic components and other products to meet the needs of our customers based on the knowledge we have accumulated through handling various products, and we are expanding our business widely in Japan and overseas. We are both a trading company and a manufacturer.
Export Trade Goods
Vendor Information
- Store Name: Seishin Trading Co., Ltd.
- Vendor: Seishin Trading Co., Ltd.
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Address:
650-0047
Hyogo Kobe 2001-4-4
Minatojima-minamimachi
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Industrial Laser Equipment, Industrial Machinery, Laser Processing Machines
LASER BLENDER – Seishin Trading Co. Ltd.
Industrial Laser Equipment, Industrial Machinery, Laser Processing MachinesLASER BLENDER – Seishin Trading Co. Ltd.
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SKU: n/a
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