Low Dk/Df Insulation Material EXSYLAM™F – UBE EXSYMO CO., LTD.
EXSYLAM F is a low dielectric constant and low dissipation factor fluoropolymer based flexible copper clad laminate board. With is excellent high frequency performance, it is suited for applications such as high frequency circuit board, antenna parts and parts for millimeter wave antenna requiring high-capacity high speed signal transfer especially in frequency range beyond 20 GHz.
“EXSYLAM” is a registered trademark of UBE Exsymo Co., Ltd. in Japan.
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Features
- Suited for high-speed transfer flexible printed circuit board application with its low dielectric constant and low dissipation factor. Flexible film based printed circuit board can be mounted after bending.
- Choice of low roughness copper foil is achieving additional low loss laminate design.
- Constant (Stable) peel strength and dimensional stability by UBE Exsymo’s proprietary laminating technology.
Supplier Information
- Store Name: UBE EXSYMO CO., LTD.
- Vendor: UBE EXSYMO CO., LTD.
- Address:
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Chemical Goods, Composite Fiber, Inorganic Chemicals
Copper Clad Laminate UPISEL™N/EXSYLAM™NT – UBE EXSYMO CO., LTD.
Chemical Goods, Composite Fiber, Inorganic ChemicalsCopper Clad Laminate UPISEL™N/EXSYLAM™NT – UBE EXSYMO CO., LTD.
UPISEL N and EXSYLAM NT are polyimide based non-adhesive flexible copper clad laminates having superior dimensional stability and heat resistance highly regarded in the electronics material industry such as mobile devises.
“UPISEL” is a registered trademark of UBE Corporation in Japan. “EXSYLAM” is a registered trademark of UBE Exsymo Co., Ltd. in Japan.SKU: n/a -
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HIPRESICA – UBE EXSYMO CO. LTD.
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