Copper Clad Laminate UPISEL™N/EXSYLAM™NT – UBE EXSYMO CO., LTD.
UPISEL N and EXSYLAM NT are polyimide based non-adhesive flexible copper clad laminates having superior dimensional stability and heat resistance highly regarded in the electronics material industry such as mobile devises.
“UPISEL” is a registered trademark of UBE Corporation in Japan. “EXSYLAM” is a registered trademark of UBE Exsymo Co., Ltd. in Japan.
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Features
- Non-adhesive copper clad laminate having excellent peeling strength, solder heat resistance, chemical resistance and dimensional stability by UBE Exsymo’s proprietary laminating process.
- This proprietary process provides laminates of wide range of copper thickness（２-300μm） and other metal foils such as copper alloy.
- There is no performance degradation due to adhesive layer and is an environmentally friendly halogen free product.
Supplier Information
- Store Name: UBE EXSYMO CO., LTD.
- Vendor: UBE EXSYMO CO., LTD.
- Address:
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Chemical Goods, Composite Fiber, Inorganic Chemicals
Low Dk/Df Insulation Material EXSYLAM™F – UBE EXSYMO CO., LTD.
Chemical Goods, Composite Fiber, Inorganic ChemicalsLow Dk/Df Insulation Material EXSYLAM™F – UBE EXSYMO CO., LTD.
EXSYLAM F is a low dielectric constant and low dissipation factor fluoropolymer based flexible copper clad laminate board. With is excellent high frequency performance, it is suited for applications such as high frequency circuit board, antenna parts and parts for millimeter wave antenna requiring high-capacity high speed signal transfer especially in frequency range beyond 20 GHz.
“EXSYLAM” is a registered trademark of UBE Exsymo Co., Ltd. in Japan.SKU: n/a -
Chemical Goods, Inorganic Chemicals
HIPRESICA – UBE EXSYMO CO. LTD.
HIPRESICA is monodisperse silica (silicon dioxide) particles produced from high purity silicon alkoxide and synthesized by a sol-gel method.
Its truly spherical particles and highly uniform particle size with little inclusion of coarse particles provide extremely sharp particle size distribution. As extremely highly pure particles, HIPRESICA has virtually no impurities. Usages for precision gap spacers in liquid crystal displays (LCD), and other displays, along with gap spacers in electric and electronic devices. Highly pure fillers for semiconductor sealing material and highly functional adhesive are also part of its application.
SKU: n/a
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