Products
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Electronic Components, Other Electronic Components
Cleaning Material for Wafer Chuck TableCleaning Wafer™ – Nitto Denko Corporation
Electronic Components, Other Electronic ComponentsCleaning Material for Wafer Chuck TableCleaning Wafer™ – Nitto Denko Corporation
The Cleaning Wafer is for removing small particles on the robot arms or chuck tables of semiconductor-manufacturing equipment.
The Cleaning Wafer, having a special cleaning layer, can remove small particles in the semiconductor manufacturing equipment. Down-time of tools can be drastically reduced by using the cleaning wafer, compared with the ordinal hand cleaning method. The cleaning wafer can also be used for preventive maintenance so that yield improvement can be expected.
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Electronic Components, Other Electronic Components
Die Attach Film with Pressure Sensitive Dicing TapeELEP MOUNT™ (EM Series) – Nitto Denko Corporation
Electronic Components, Other Electronic ComponentsDie Attach Film with Pressure Sensitive Dicing TapeELEP MOUNT™ (EM Series) – Nitto Denko Corporation
Achieves high reliability by combining dicing and die attachment functions.
This adhesive film is for fixing IC chips to a lead frame or interposer in the semiconductor assembly process. It is useful in realizing high adhesive reliability and in BOC and stacked CSP manufacturing processes, solving conventional silver paste bleeding problems which cause short circuits. It has also been designed to enable use in a continuous process in combination with fixing tape for dicing.
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Electronic Components, Other Electronic Components
Heat Resistance Back Grinding Tape – Nitto Denko Corporation
Electronic Components, Other Electronic ComponentsHeat Resistance Back Grinding Tape – Nitto Denko Corporation
Back-grinding tape with heat resistance is for special heating process after wafer grinding.
Heat resistance back grinding tape can correspond to the secondary process of wafer backside. After the back-grinding process, the wafers with the heat resistance back grinding tape can be processed (wet etching, ashing, metalizing, exposure/processing and so on).
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Electronic Components, Other Electronic Components
Heat-resistant Low Adhesion SheetPW(PROSS WELL) / TRM Series – Nitto Denko Corporation
Electronic Components, Other Electronic ComponentsHeat-resistant Low Adhesion SheetPW(PROSS WELL) / TRM Series – Nitto Denko Corporation
Outstanding heat resistance can be used in various applications.
PW/TRM series are products which combines Nitto Denko’s advanced adhesion controlled technology with heat resistant base materials and adhesives, and is applied in various electronic components and device processes. With the wide variety of outstanding heat resistant characteristics, PW/TRM series can be applied to temporary fixing and masking in heating processes, and can be used for protection and transport of film components. The adhesives can be chosen from acrylic-based adhesives and other silicon-based adhesives, suitable for heating applications, to meet customer needs.
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Electronic Components, Heatspreader
Thermal Conduction Sheet with Superior Heat Dissipation and a Remarkable Cooling Effect in Electronic DevicesHT Sheet – Nitto Denko Corporation
Electronic Components, HeatspreaderThermal Conduction Sheet with Superior Heat Dissipation and a Remarkable Cooling Effect in Electronic DevicesHT Sheet – Nitto Denko Corporation
This thermal conduction sheet is effective for heating and cooling of integrated circuit devices, etc.
Provides excellent thermal conductivity using silicon gel as a matrix resin.
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Company Profile
Aiming to become an essential top ESG company that continually brings amazement and inspiration.
Nitto was founded in 1918, and it has been a manufacturer of high-performance materials ever since, providing a wide range of products globally.
We are committed to innovating in a customer-oriented manner.
Under the brand slogan “Innovation for Customers,” we serve the global environment, humankind and society as our customers as well and continue to take on challenges for a sustainable future and everyone’s wellbeing.
Nitto’s Ideal State

The Nitto Group will continually challenge to inspire the world and create values that the society recognizes, taking the changes of the society as an opportunity with our corporate mission of “Contribute to customers’ value creation with innovative ideas”.
Implementing Our Niche Top Strategy and Nitto-Style ESG Strategy
Nitto aims to become an essential top ESG company through the implementation of our Niche Top Strategy and Nitto-Style ESG Strategy, which involves anticipating market changes and leveraging our technological strengths to create products and services that contribute to the environment and humanity.
Nitto’s Original Business Models
Finding “new” applications for existing products and the adding new technologies to them or using new technologies to develop “new” products and the expanding their applications, thereby creating “new” demand – Literally translated as “three new activities,” Sanshin Activities is Nitto Group’s proprietary marketing approach which we have diligently followed for more than 50 years by repeating the cycle of the three “news” for continued progress.
Global Niche Top™ strategy directs our drive for a leading share in the global market, whereas Area Niche Top™ strategy guides us to the leading position in national and regional markets as we offer products that meet the specific needs of each area.
“Global Niche Top” and “Area Niche Top” are trademarks of the Nitto Group.
“Global Niche Top”, is a trademark launched by Nitto in the mid-1990s and was registered in Japan in 2002. It is a management strategy that has supported Nitto’s growth.